LINEAR TECHNOLOGY MATERIALS DECLARATION

LTM9001CV-GA#PBF (Engineering Calculation) 11.25 X 11.25 X 2.32 LGA 81Lead Plastic  
(printed on: 11/20/2009 11:37:10 PM) TOTAL MASS (g): 0.014462
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.010515 1000000 727,077
Die Coat Dow Corning Silicone 67762-90-7 0 0 0
Lead Frame BT P4 0.32mm Copper (Cu) 7440-50-8 0 0 0
Iron (Fe) 7439-89-6 0 0 0
Phosporus (P) 7723-14-0 0 0 0
Zinc (Zn) 7440-66-6 0 0 0
Nickel (Ni) 7440-02-0 0 0 0
Silicon (Si) 7440-21-3 0 0 0
Magnesium (Mg) 7439-95-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead Frame Total: 0 1000000 0
Plating PMI Exter. Plating Pb 7439-92-1 0 0 0
Exter. Plating Sn 7440-31-5 0 1000000 0
External Plating Total: 0 1000000 0
Inter. Plating Ni 7440-02-0 0 0 0
Inter. Plating Ag 7440-22-4 0 0 0
Internal Plating Total: 0 1000000 0
Die Attach 95Sn / 5Sb Silver (Ag) 7440-22-4 0 0 0
Tin (Sn) 7440-31-5 0.000197 50,000 13621
Lead (Pb) 7439-92-1 0.00375 950,000 259300
Silica (SiO2) 60676-86-0 0 0 0
Resin (EP)   0 0 0
Die Attach Total: 0.003947 1000000 272,922
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0 0 0
Bromine (Br) 10097-32-2 0 0 0
Silica (SiO2) 60676-86-0 0 0 0
Antimony
Trioxide (Sb2O3)
1309-64-4 0 0 0
Metal Hydroxid   0 0 0
Carbon Black (C) 1333-86-4 0 0 0
Encapsulation Total: 0 1000000 0
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0 0 0
  TOTAL MASS (g): 0.014462