LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2452IDDB#TRMPBF (Engineering Calculation) DFN 3mm X 2mm Exp. Pad 8Lead Plastic  
(printed on: 11/20/2009 11:18:16 PM) TOTAL MASS (g): 0.0134726
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000417 1000000 30,927
Die Coat Dow Corning Silicone 67762-90-7 0 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.004212 975,000 312634
Iron (Fe) 7439-89-6 0.000103 24,000 7645
Phosporus (P) 7723-14-0 1e-006 300 74
Zinc (Zn) 7440-66-6 3e-006 700 222
Nickel (Ni) 7440-02-0 0 0 0
Silicon (Si) 7440-21-3 0 0 0
Magnesium (Mg) 7439-95-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead Frame Total: 0.004319 1000000 320,329
Plating PMI Exter. Plating Pb 7439-92-1 0 0 0
Exter. Plating Sn 7440-31-5 0.000184606 1000000 13702
External Plating Total: 0.000184606 1000000 13702.4
Inter. Plating Ni 7440-02-0 0 0 0
Inter. Plating Ag 7440-22-4 0.000103 1,000,000 7645
Internal Plating Total: 0.000103 1000000 7,639
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000352 750,000 26127
Tin (Sn) 7440-31-5 0 0 0
Lead (Pb) 7439-92-1 0 0 0
Silica (SiO2) 60676-86-0 0 0 0
Resin (EP)   0.000117 250,000 8684
Die Attach Total: 0.000469 1000000 34,784
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001033 130,000 76674
Bromine (Br) 10097-32-2 0 0 0
Silica (SiO2) 60676-86-0 0.006837 860,000 507474
Antimony
Trioxide (Sb2O3)
1309-64-4 0 0 0
Metal Hydroxid   0 0 0
Carbon Black (C) 1333-86-4 7.9e-005 10,000 5863
Encapsulation Total: 0.007949 1000000 589,557
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 3.1e-005 1000000 2300
  TOTAL MASS (g): 0.0134726