LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2452CTS8#TRMPBF (Engineering Calculation) TSOT-23 8Lead Plastic  
(printed on: 11/20/2009 10:50:40 PM) TOTAL MASS (g): 0.0119937
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000417 1000000 34,660
Die Coat Dow Corning Silicone 67762-90-7 0 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.004582 975,000 382033
Iron (Fe) 7439-89-6 0.000112 24,000 9338
Phosporus (P) 7723-14-0 1e-006 300 83
Zinc (Zn) 7440-66-6 3e-006 700 250
Nickel (Ni) 7440-02-0 0 0 0
Silicon (Si) 7440-21-3 0 0 0
Magnesium (Mg) 7439-95-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead Frame Total: 0.004698 1000000 390,491
Plating PMI Exter. Plating Pb 7439-92-1 0 0 0
Exter. Plating Sn 7440-31-5 0.00066269 1000000 55253
External Plating Total: 0.00066269 1000000 55253.2
Inter. Plating Ni 7440-02-0 0 0 0
Inter. Plating Ag 7440-22-4 8e-005 1,000,000 6670
Internal Plating Total: 8e-005 1000000 6,649
Die Attach ELECTRICALLY INSULATING ADHESIVE Silver (Ag) 7440-22-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead (Pb) 7439-92-1 0 0 0
Silica (SiO2) 60676-86-0 8e-006 80,000 667
Resin (EP)   6.1e-005 550,000 5086
Die Attach Total: 6.9e-005 1000000 9,143
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000346 58,000 28848
Bromine (Br) 10097-32-2 0 0 0
Silica (SiO2) 60676-86-0 0.005322 890,000 443732
Antimony
Trioxide (Sb2O3)
1309-64-4 0 0 0
Metal Hydroxid   0.000299 50,000 24929
Carbon Black (C) 1333-86-4 1.1e-005 2,000 917
Encapsulation Total: 0.005978 1000000 496,883
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 8.9e-005 1000000 7420
  TOTAL MASS (g): 0.0119937