LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2451ITS8#TRMPBF (Engineering Calculation) TSOT-23 8Lead Plastic  
(printed on: 11/20/2009 11:36:17 PM) TOTAL MASS (g): 0.0120857
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000498 1000000 41,078
Die Coat Dow Corning Silicone 67762-90-7 0 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.004582 975,000 379125
Iron (Fe) 7439-89-6 0.000112 24,000 9267
Phosporus (P) 7723-14-0 1e-006 300 82
Zinc (Zn) 7440-66-6 3e-006 700 248
Nickel (Ni) 7440-02-0 0 0 0
Silicon (Si) 7440-21-3 0 0 0
Magnesium (Mg) 7439-95-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead Frame Total: 0.004698 1000000 387,527
Plating PMI Exter. Plating Pb 7439-92-1 0 0 0
Exter. Plating Sn 7440-31-5 0.00066269 1000000 54832
External Plating Total: 0.00066269 1000000 54832.6
Inter. Plating Ni 7440-02-0 0 0 0
Inter. Plating Ag 7440-22-4 8e-005 1,000,000 6619
Internal Plating Total: 8e-005 1000000 6,599
Die Attach ELECTRICALLY INSULATING ADHESIVE Silver (Ag) 7440-22-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead (Pb) 7439-92-1 0 0 0
Silica (SiO2) 60676-86-0 1e-005 80,000 827
Resin (EP)   7e-005 550,000 5791
Die Attach Total: 8e-005 1000000 10,475
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.000346 58,000 28628
Bromine (Br) 10097-32-2 0 0 0
Silica (SiO2) 60676-86-0 0.005322 890,000 440355
Antimony
Trioxide (Sb2O3)
1309-64-4 0 0 0
Metal Hydroxid   0.000299 50,000 24739
Carbon Black (C) 1333-86-4 1.1e-005 2,000 910
Encapsulation Total: 0.005978 1000000 493,112
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 8.9e-005 1000000 7364
  TOTAL MASS (g): 0.0120857