LINEAR TECHNOLOGY MATERIALS DECLARATION |
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| LTC2451IDDB#PBF | (Engineering Calculation) | DFN 3mm X 2mm Exp. Pad 8Lead Plastic | ||||||
| (printed on: 11/20/2009 10:50:22 PM) | TOTAL MASS (g): | 0.0136226 | ||||||
| COMPONENT MATERIAL |
VENDOR/ INDUSTRY NAMES |
CONSTITUENT NAME |
CAS NUMBER |
CONSTITUENT MASS (g) |
CONSTITUENT (PPM) OF MATERIAL |
CONSTITUENT (PPM) OF TOTAL PKG. |
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| Active Device | Linear Technology | Silicon (Si) | 7440-21-3 | 0.000498 | 1000000 | 36,529 | ||
| Die Coat | Dow Corning | Silicone | 67762-90-7 | 0 | 0 | 0 | ||
| Lead Frame | Cu | Copper (Cu) | 7440-50-8 | 0.004212 | 975,000 | 309192 | ||
| Iron (Fe) | 7439-89-6 | 0.000103 | 24,000 | 7560 | ||||
| Phosporus (P) | 7723-14-0 | 1e-006 | 300 | 73 | ||||
| Zinc (Zn) | 7440-66-6 | 3e-006 | 700 | 220 | ||||
| Nickel (Ni) | 7440-02-0 | 0 | 0 | 0 | ||||
| Silicon (Si) | 7440-21-3 | 0 | 0 | 0 | ||||
| Magnesium (Mg) | 7439-95-4 | 0 | 0 | 0 | ||||
| Tin (Sn) | 7440-31-5 | 0 | 0 | 0 | ||||
| Lead Frame Total: | 0.004319 | 1000000 | 316,804 | |||||
| Plating | PMI | Exter. Plating Pb | 7439-92-1 | 0 | 0 | 0 | ||
| Exter. Plating Sn | 7440-31-5 | 0.000184606 | 1000000 | 13551 | ||||
| External Plating Total: | 0.000184606 | 1000000 | 13551.5 | |||||
| Inter. Plating Ni | 7440-02-0 | 0 | 0 | 0 | ||||
| Inter. Plating Ag | 7440-22-4 | 0.000103 | 1,000,000 | 7560 | ||||
| Internal Plating Total: | 0.000103 | 1000000 | 7,555 | |||||
| Die Attach | ELECTRICALLY CONDUCTIVE ADHESIVE | Silver (Ag) | 7440-22-4 | 0.000404 | 750,000 | 29656 | ||
| Tin (Sn) | 7440-31-5 | 0 | 0 | 0 | ||||
| Lead (Pb) | 7439-92-1 | 0 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0 | 0 | 0 | ||||
| Resin (EP) | 0.000134 | 250,000 | 9836 | |||||
| Die Attach Total: | 0.000538 | 1000000 | 39,463 | |||||
| Encapsulation | MULTI-AROMATIC RESIN Br/Sb FREE | Resin (EP) | 0.001033 | 130,000 | 75829 | |||
| Bromine (Br) | 10097-32-2 | 0 | 0 | 0 | ||||
| Silica (SiO2) | 60676-86-0 | 0.006837 | 860,000 | 501886 | ||||
| Antimony Trioxide (Sb2O3) |
1309-64-4 | 0 | 0 | 0 | ||||
| Metal Hydroxid | 0 | 0 | 0 | |||||
| Carbon Black (C) | 1333-86-4 | 7.9e-005 | 10,000 | 5799 | ||||
| Encapsulation Total: | 0.007949 | 1000000 | 583,070 | |||||
| Bond Wire Estimated |
AFW/TANAKA/ Kn | Gold (Au) | 7440-57-5 | 3.1e-005 | 1000000| 2275 |
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| TOTAL MASS (g): | 0.0136226 | |||||||