LINEAR TECHNOLOGY MATERIALS DECLARATION

LTC2274IUJ#TRPBF (Engineering Calculation) QFN 6mm X 6mm Exp. Pad 40Lead Plastic  
(printed on: 11/20/2009 11:37:26 PM) TOTAL MASS (g): 0.111273
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.007927 1000000 71,088
Die Coat Dow Corning Silicone 67762-90-7 0 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.04366 975,000 392368
Iron (Fe) 7439-89-6 0.001074 24,000 9651
Phosporus (P) 7723-14-0 1.3e-005 300 116
Zinc (Zn) 7440-66-6 3.1e-005 700 278
Nickel (Ni) 7440-02-0 0 0 0
Silicon (Si) 7440-21-3 0 0 0
Magnesium (Mg) 7439-95-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead Frame Total: 0.044778 1000000 401,563
Plating PMI Exter. Plating Pb 7439-92-1 0 0 0
Exter. Plating Sn 7440-31-5 0.00419388 1000000 37690
External Plating Total: 0.00419388 1000000 37690.1
Inter. Plating Ni 7440-02-0 0 0 0
Inter. Plating Ag 7440-22-4 0.000108 1,000,000 970
Internal Plating Total: 0.000108 1000000 968
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.002465 750,000 22152
Tin (Sn) 7440-31-5 0 0 0
Lead (Pb) 7439-92-1 0 0 0
Silica (SiO2) 60676-86-0 0 0 0
Resin (EP)   0.000821 250,000 7378
Die Attach Total: 0.003286 1000000 29,468
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.00654 130,000 58774
Bromine (Br) 10097-32-2 0 0 0
Silica (SiO2) 60676-86-0 0.043266 860,000 388827
Antimony
Trioxide (Sb2O3)
1309-64-4 0 0 0
Metal Hydroxid   0 0 0
Carbon Black (C) 1333-86-4 0.000503 10,000 4520
Encapsulation Total: 0.050309 1000000 451,165
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 0.000671 1000000 6030
  TOTAL MASS (g): 0.111273