LINEAR TECHNOLOGY MATERIALS DECLARATION

LT3755EUD#PBF (Engineering Calculation) QFN 3mm X 3mm Exp. Pad 16Lead Plastic  
(printed on: 11/20/2009 11:18:29 PM) TOTAL MASS (g): 0.0230038
COMPONENT
MATERIAL
VENDOR/
INDUSTRY NAMES
CONSTITUENT
NAME
CAS
   NUMBER   
CONSTITUENT
MASS (g)
CONSTITUENT
(PPM) OF MATERIAL
CONSTITUENT
(PPM) OF TOTAL PKG.
Active Device Linear Technology Silicon (Si) 7440-21-3 0.000861 1000000 37,390
Die Coat Dow Corning Silicone 67762-90-7 0 0 0
Lead Frame Cu Copper (Cu) 7440-50-8 0.008751 975,000 380415
Iron (Fe) 7439-89-6 0.000215 24,000 9346
Phosporus (P) 7723-14-0 2e-006 300 86
Zinc (Zn) 7440-66-6 6e-006 700 260
Nickel (Ni) 7440-02-0 0 0 0
Silicon (Si) 7440-21-3 0 0 0
Magnesium (Mg) 7439-95-4 0 0 0
Tin (Sn) 7440-31-5 0 0 0
Lead Frame Total: 0.008974 1000000 389,716
Plating PMI Exter. Plating Pb 7439-92-1 0 0 0
Exter. Plating Sn 7440-31-5 0.000412761 1000000 17943
External Plating Total: 0.000412761 1000000 17943.2
Inter. Plating Ni 7440-02-0 0 0 0
Inter. Plating Ag 7440-22-4 0.000203 1,000,000 8824
Internal Plating Total: 0.000203 1000000 8,815
Die Attach ELECTRICALLY CONDUCTIVE ADHESIVE Silver (Ag) 7440-22-4 0.000518 750,000 22518
Tin (Sn) 7440-31-5 0 0 0
Lead (Pb) 7439-92-1 0 0 0
Silica (SiO2) 60676-86-0 0 0 0
Resin (EP)   0.000172 250,000 7477
Die Attach Total: 0.00069 1000000 29,964
Encapsulation MULTI-AROMATIC RESIN Br/Sb FREE Resin (EP)   0.001534 130,000 66684
Bromine (Br) 10097-32-2 0 0 0
Silica (SiO2) 60676-86-0 0.010148 860,000 441144
Antimony
Trioxide (Sb2O3)
1309-64-4 0 0 0
Metal Hydroxid   0 0 0
Carbon Black (C) 1333-86-4 0.000118 10,000 5129
Encapsulation Total: 0.0118 1000000 512,441
Bond Wire
Estimated
AFW/TANAKA/ Kn Gold (Au) 7440-57-5 6.3e-005 1000000 2738
  TOTAL MASS (g): 0.0230038